Mini Workshop: Tracking

Proposed session agenda 10h30 – 12h15 Possible Collaboration Projects 12h15 – 13h00 VLDT Nodes  clients relations

Task identify collaboration within the HHA – Network !  new projects: beyond what we do anyway! semiconductor tracking detectors: sLHC and ILC and …. gaseous detectors: ILC is there any ILC/sLHC common development/infrastructure ?  think what could be useful to have available within HHA on shorter time scale borrowable free of extra cost what decreases thresholds to do something

2 + 1 areas Projects with true collaboration beyond project boundaries example: powering (serial, DC-DC) Generic „useful systems“ which allow collaboration beyond specific projects (ATLAS/CMS, sLHC/ILC) example: Purchases with HHA money to ease general develpment needs examples: supply of strip sensors/hybids supply of pixel chips

1. „HHA-Projects“ with true collaboration  WHO ?? Powering schemes: serial / DC-DC regular collaboration between pixel/strip communities development of a DC-DC convertor IC only interesting for semiconductor detectors ? Mechanics usage/dev. of new compound materials  is a common dev. possible? Micro integration TSV, 3D presently collaborating Bonn/MPI with 2xIZM sLHC Track – Level Triggering task force ? Simulation/software of irradiation effects Opto Readout Development (Gbit versatile link, …) LCTPC LP System Integration DCS Dev.  ILC/sLHC commonalities ? power pulsing (ILC) ? AC, BN, Go, HD WU, DESY BN, MPI MZ, GÖ, HD, WU HH, DO, MPI WU, HD BN, FR, MZ, DESY, HR, KA SI DESY, WU, SI all ILC groups

2. Generic „useful“ developments/organisations Generic chip and chip/sensor assemply testing platform in progress in Bonn/Göttingen Irradiation dev. of „easy“ irradiation infrastructure „in Absprache“ among the groups Generic EMI test setup  perhaps purchase  deferred Generic sensor test qualification structures (standard measurement and analysis methods) IC development  DCS chip  DC-DC convertors  regulators for SP IC supply for general use  BEETLE Chip EUDET Telescope  from demonstrator  2 telescopes inventory of existing parts/equipment  know-how data base  wiki Cooling concepts (CO2 system for tests) BN, Gö KA, DESY, HH, BN AC, DESY FR, HH, KA BN, HD, AC, WU HD DESY, BN all / who starts ? KA, AC, Desy?

3. Purchases Is there an interest in aquiring/buying ATLAS/CMS pixel/strip IC wafers ?  with HHA money? ATLAS pixel FE-I3 CMS pixel ROC strip chips from ATLAS/CMS strip chips VA-family from IDEAS (Oslo) Timepix/medipix …. complete pixel modules/hybrids complete strip modules/hybrids … e.g. for test beams complete R/O systems/platforms ….

Chip design infrastructure – „Perspektivendiskussion“ Angebot von Chipdesign-Arbeitsplätzen im HHA-Labor Rechner-Hardware Büro/Laborraum Support für externe Chipdesign-Arbeitsplätze Zugriff auf „Standard“-Cadence/Design-Kit Installation (LINUX) Remote-Administration  zu aufwändig Entwicklung von Chips/Standard-Designblöcken  small chips Entwurf und Entwicklung kompletter Chips auf Anfrage I/O Pads, DACs, ADCs, BG-Referenz, …  in einer Technologie  IBM CMRF8SF 130 nm Training  Benutzung von Cadence-Tools  Entwicklung von Tutorials Chipdesign-Training  nein: externe Chipdesign-Kurse benutzen